0.55mm Ultra Thin Wire Diamond Wire Saw Machine for Precision Stone Cutting

The Xianda Machinery JSWS-3400-22 features advanced 0.55mm ultra-thin diamond wire technology that delivers exceptional cutting precision with minimal material loss. The ultra-thin wire profile creates narrower kerf width, resulting in more slabs per block and significantly reduced stone waste compared to conventional wire saws.

• 0.55mm Ultra Thin Diamond Wire – Industry-leading thin wire technology minimizes kerf loss by up to 40% compared to standard wire diameters
• 0.1mm Wire Diameter Precision – Fine wire gauge enables ultra-smooth cutting surface finish requiring minimal post-processing
• Superior Surface Quality – ±0.01mm cutting precision delivers ready-to-polish slab surfaces straight from the machine
• Multi-wire Simultaneous Cutting – Multiple wires operate concurrently for maximum throughput and production efficiency
• Water Cooling Circulation – Advanced cooling system maintains stable wire temperature preventing diamond bead wear
• Siemens PLC Touch Screen Control – Intuitive interface with programmable cutting parameters and real-time monitoring

• Specifically engineered for high-value marble and engineered stone slab production where material yield optimization is critical
• Ideal for premium stone processors, quartz countertop manufacturers, and export-oriented stone factories